Consumers demand electronics to be fully mobile with more processing power and better performance. Smaller products with higher performance face the challenge of dramatically increasing power density. Excessive heat damages internal components and can cause products to perform poorly, shorten product lifespans, and put consumers at risk for heat-related injuries. To ensure long mobile electronic lifetimes, effective thermal management solutions must dissipate heat efficiently and safely. Dissipating heat more quickly and effectively enables greater power density designs, which either means smaller dimensional footprint of devices or higher-powered internal components resulting in smaller handheld devices.